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    Innovation Village | Technology, Product Reviews, Business
    You are at:Home»Events»Intel CEO Pat Gelsinger Announces ‘IDM 2.0’ Strategy to Drive Sustained Technology and Product Leadership
    During recording of the “Intel Unleashed: Engineering the Future” webcast, Intel CEO Pat Gelsinger highlights "Ponte Vecchio," Intel's first exascale graphics processing unit. During the webcast on March 23, 2021, Gelsinger outlines the company’s path forward to manufacture, design and deliver leadership products and create long-term value for stakeholders. (Credit: Walden Kirsch/Intel Corporation)

    Intel CEO Pat Gelsinger Announces ‘IDM 2.0’ Strategy to Drive Sustained Technology and Product Leadership

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    By Smart Megwai on March 24, 2021 Events, New Product Development, News, Press Release

    Since Pat Gelsinger took over as Intel’s new CEO, he has brought changes into the organisation. On the 23rd of March 2021, he shared his vision for “IDM 2.0,” a major evolution of Intel’s integrated device manufacturing (IDM) model.

    Pat has announced the company’s plans to grow its product development, starting with an estimated $20 billion investment to build two new factories (or “fabs”) in Arizona. He also announced Intel’s plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally. 

    According to him, this is part of a new “IDM 2.0” strategy for Intel’s design and manufacturing. This next move by Intel is threefold will enable the company to drive sustained technology and product leadership.

    The exact words he used during the press release were, “We are setting a course for a new era of innovation and product leadership at Intel. Intel is the only company with the depth and breadth of software, silicon and platforms, packaging, and process with at-scale manufacturing customers can depend on for their next-generation innovations. IDM 2.0 is an elegant strategy that only Intel can deliver – and it’s a winning formula. We will use it to design the best products and manufacture them in the best way possible for every category we compete in.”

    With this, the company is expected to create over 3,000 permanent high-tech, high-wage jobs; over 3,000 construction jobs; and approximately 15,000 local long-term jobs. It plans to engage the technology ecosystem and industry partners to deliver on its IDM 2.0 vision.

    To this end, Intel and IBM will collaborate to create the next–generation logic and packaging technologies. For more than 50 years, the two companies have shared a deep commitment to scientific research, world-class engineering and a focus on bringing advanced semiconductor technologies to market. These foundational technologies will help unleash the potential of data and advanced computation to create immense economic value.

    The company has said that this collaboration will accelerate semiconductor manufacturing innovation across the ecosystem, enhance the competitiveness of the U.S. semiconductor industry and support key U.S. government initiatives.

    Finally, Intel is bringing back the spirit of its popular Intel Developer Forum event this year with the launch of Intel On, a new industry event series.

    Pat encouraged technology lovers to join him at this year’s Intel Innovation event planned for October in San Francisco.

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    Smart Megwai
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    Smart is a Tech Writer. His passion for educating people is what drives him to provide practical tech solutions which helps solve everyday tech-related issues.

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